MediaTek to announce sub-flagship Dimensity 8300 SoC on Nov 21

MediaTek officially launched the next-generation “Dimensity 9300 SoC” a few days ago. So far, it has announced the launch of a sub-flagship chipset named “Dimensity 8300” on November 21 at 3:00 p.m. Beijing time, with the slogan “Ice Peak Energy Efficiency Super God Evolution”.

MediaTek to launch sub-flagship Dimensity 8300 SoC

The Dimensity 8300 SoC, according to speculation, is integrated into a 1+3+4 architecture using ARMv9 cores. Its Prime Cortex-X3 core is clocked at 2.8 GHz (1x) plus 3 Cortex-A715 cores clocked at 2.4 GHz, and finally, there are 4 power-efficient Cortex-A510 cores clocked at 1.6 GHz. For comparison, the flagship Dimensity 9300 SoC also features an octa-core architecture using 1 Cortex-X4 core (at 3.25 GHz), 3 Cortex-X4 cores (at 2.85 GHz), and 4 Cortex cores. -A720 with energy efficiency at 2.0. GHz.

For the uninitiated, the Dimensity 8300 SoC is a cooled version of the Dimensity 9300 SoC and sits almost parallel to last year’s Dimensity 9200 SoC. The chipset is expected to be built on TSMC’s 4nm N4P process. Of course, it won’t match the capabilities of the DImensity 9300 SoC that powers the latest Vivo X100 Pro, let alone the all-powerful Qualcomm Snapdragon 8 Gen 3 SoC.

Moving further, tech enthusiasts are eagerly waiting for the chipset to arrive on November 21, as it will power a range of sub-flagship phones. As of now, not much is known about the chipset, although we should hope for an affordable price and better value for money with the same.

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