Samsung Eyes Exynos 2500 And Qualcomm’s Return With FOWLP: Report،
Samsung Electronics is set to adopt a new processor packaging technique for its high-end Exynos processors to power the flagship Galaxy S series. According to a report from Hankooki.com, the Korean tech giant is turning to Fan-Out Wafer-Level Packaging technology for the Exynos 2500 SoC of the Galaxy S25 series. This decision aims to improve […]
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