Mediatek Dimensity 9400 SoC coming Q4 with advanced AI features

admin1 February 2024Last Update :
Mediatek Dimensity 9400 SoC coming Q4 with advanced AI features

Mediatek Dimensity 9400 SoC coming Q4 with advanced AI features،

The MediaTek Dimensity 9300 chipset has an interesting configuration consisting of four main Cortex-X4 processor cores and four Cortex-A720 performance processor cores. Cores with low energy efficiency? No, it's for sissies. The Dimensity 9400 SoC is expected to be equipped with one Cortex-X5 Prime processor core, four Cortex-X4 Prime processor cores, and four Cortex-A720 performance processor cores. Listen, mom. Again, no core of efficiency.

Additionally, the chipset will be the first Dimensity component manufactured using TSMC's 3nm process node. Certainly, it will be the foundry's second-generation 3nm process node, the N3E, which should lead to performance improvements and/or greater power efficiency. By China Times (via Wccftech), MediaTek CEO Rick Tsai said in a ceremony on Tuesday that the Dimensity 9400 application processor (AP) will arrive in the fourth quarter and will have AI capabilities that rival other chipsets.
MediaTek did not specifically refer to the chip as the Dimensity 9400, but it seems likely that Tsai was referring to the fabless chip designer's upcoming flagship chip. The Dimensity 9400, like its predecessor, will support LPDDR5T RAM, which is essential to the chip's ability to perform AI features on the device. The chip is expected to surpass the Dimensity 9300's 33 billion parameter large language model. This should lead to improved AI capabilities for the chip.

The Dimensity 9400 AP's most obvious rival is Qualcomm's Snapdragon 8 Gen 4, which will debut with Qualcomm's own Oryon cores and will also lack efficiency cores like the Dimensity 9400. The Snapdragon 8 Gen 4 will also be produced by TSMC using its second generation 3nm. node.

Without any efficiency core, there were fears that the Dimensity 9300 SoC might overheat and there were indeed rumors last September, which MediaTek of course denied. A stress test performed on the Dimensity 9300 SoC showed that the chipset reduced performance by 46% after introducing stress into the hotspot cores. On the other hand, the chip runs the Vivo X100 series, and aside from the stress test mentioned above, we didn't see any major overheating issues. This bodes well for the Dimensity 9400 AP.