MediaTek Dimensity 8300 SoC arrives with ARM v9 cores, LPDDR5x, 60% faster GPU & Generative AI capabilities

It’s here and it’s official. The sub-flagship Dimensity 8000 chipset that made headlines a few days ago is finally launched. Called the MediaTek Dimensity 8300, it’s built on a second-generation 4nm process from TSMC. The chipset, as noted, is the successor to the Dimensity 8200 SoC. Here is everything you need to know about the chipset and what it brings.

MediaTek Dimensity 8300 SoC debuted

Dimensity 8300, the direct successor to the Dimensity 8200, sports four high-performance ARM Cortex-A715 cores clocked at up to 3.35 GHz. It is then split into a 1+3 core configuration. Additionally, there are four energy-efficient ARM Cortex-A510 cores with a maximum frequency of 2.2 GHz. The Dimensity 8200 SoC has a maximum frequency of 3.1 GHz on its high-performance Cortex-A78 core.

Based on ARM v9 architecture, the CPU delivers 20% faster performance while the power efficiency cores deliver a 30% peak compared to the last generation 8200. As for the GPU, it is ARM Mali-G615 MC6 which is said to offer a 60% gain in performance and 55% improvement in power efficiency when humming at its peak speeds.

MediaTek says the new chipset can speed up cold launch of apps by 17%, while launch of idle apps has been sped up by 47% at its extremes. The chipset also supports UFS 4.0 storage with MCQ and quad-channel LPDDR5X RAM at a maximum speed of 8,533 Mbps. Compare it with its predecessor and you’re talking about an increase in UFS 3.1 and LPDDR5 up to 6,400 Mbps respectively.

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